Super high frequency module

Abstract

Abstract PURPOSE:To obtain a module for free loading-unloading and good heat radiation wherein the discontinuity of the electromagnetic field is reduced at the connection part, by providing a flange on the upper surface of a carrier and fitting to the recess of a casing, and arranging a metallic thin film sheet for good heat radiation on the bottom surface of the recess. CONSTITUTION:A dielectric substrate 21 provided with a high frequency circuit, etc. is mounted on a carrier 12 resulting in a unit which is fitted to the casing 13 after various tests and the finish. The effect of heat radiation of the circuit unit is enhanced by providing an In foil on the casing bottom. When loading, the flange 15 is engaged to the step part 17 of the groove 15 for carrier insertion and closely contacted on the foil 14 on the bottom. In this constitution, the interval A between the flange 15 of the unit module 12 and the upper surface of the dielectric substrate 1 forms a grounding circuit, the distance to the grounding part is shortened, and thus the discontinuity of the electromagnetic field can be reduced. Further, the thermal resistance between the carrier and the casing is decreased by a light metal, and a module available for the range of super high frequency is obtained.

Inventors

• 👤 Toshiro Sakane
• 👤 坂根　敏朗
• 👤 Toshiyuki Saito
• 👤 俊幸 斉藤

Bibliographic Details