Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To easily perform positioning, by arranging an objective lens having a cross line on the front surface side and a marking needle on the back surface side, aligning the axial center and punching a groove on the back surface side, when the work corresponded to patterns provided from the back surface side to the front surface side of a semiconductor wafer is performed. CONSTITUTION:On the lower surface of a transparent plate 53 constituted of a glass plate, etc. wherein holes 54 for vacuum suction are provided from the periphery to the lower surface, the surface 101 of the semiconductor wafer 100 to be worked is arranged and attracted by using the holes 54. Next, the objective lens 51 having a cross line in the inside is provided above the transparent plate 53, and a marking needle 52 is arranged on the back surface 102 side of the wafer 100. Thereafter, the axial center of the needle 52 is aligned to the axial center 55 of the lens 51, and the pair is horizontally moved. Thereafter, the desired groove 56 in the direction X is punched by pressing the needle 52 on the back surface 102 of the wafer 100. In the same manner, the groove 57 in the direction Y is punched resulting in the groove corresponded to the pattern formed on the surface 101.

Inventors

• 👤 Keishiro Yonezawa
• 👤 米沢　啓四郎

Bibliographic Details