High density mounting package

Abstract

Abstract PURPOSE:To enhance the cooling efficiency by making semiconductor circuit elements to be cooled from both faces, and to enable to mount the semiconductor circuit elements in high density by a method wherein the semiconductor circuit element of LSI chips, etc., are connected radially and in vertical condition to the outside circumference of a ceramic multilayer circuit substrate. CONSTITUTION:A high density mounting package 2 is consisting of the cylindrical ceramic multilayer circuit substrate 3, the LSI chips 4 of the plural number connected radially to the outside circumference of the ceramic multilayer circuit substrate 3, and a tightly sealing case 5 to cover them, and an inactive coolant of fluorocarbon, etc., is enclosed in the tightly sealing case 5. The high density mounting package 2 is mounted on a mother substrate 1 by inserting terminals 9 projecting from the lower face thereof into through-holes in the mother substrate 1 to be soldered. The respective LSI chips 4 are connected radially to the outside circumference of the ceramic multilayer circuit substrate 3 to be cooled from both faces by the coolant, heat thereof is transmitted efficiently to the tightly sealing case 5, and the circumference of the tightly sealing case 5 is cooled by air or a liquid.

Inventors

• 👤 Kishio Yokouchi
• 👤 貴志男 横内
• 👤 Nobuo Kamehara
• 👤 亀原　伸男
• 👤 Koichi Niwa
• 👤 丹羽　紘一

Bibliographic Details