Electron circuit device

Abstract

Abstract PURPOSE:To simplify the manufacturing process of the title device and to obtain a solid structure, excellent waterproof and humidity resistance properties for the device by a method wherein an IC chip is directly adhered on a conductor pattern using die-bonding and the like, and an IC electrode and the finger of the conductor pattern are coupled using a wire-bonding. CONSTITUTION:An IC chip 6 is die-bonded on the gold-plated layer 5 of the trapezoidal part 3 of the conductor pattern using an Au-Si eutectic material or a conductive bonding agent 8. Then, each electrode of the IC chip 6 and the finger part 2 of the conductor pattern corresponding to said electrode are wire- bonded using a gold or aluminum wire 7, and then a necessary electron circuit is formed on an insulating film 1 by attaching or forming a required electron circuit constituting element. Then, the processed insulating film 1 is folded back in the center part, and sealed by the same bonding agent 12 which was used on the peripheral region of the insulating film 1 or by performing thermal-press welding in such a manner that the electron circuit part will be enveloped.

Inventors

• 👤 Norio Isshiki
• 👤 功雄 一色
• 👤 Masatoshi Tanaka
• 👤 正敏 田仲
• 👤 Seiji Takeuchi
• 👤 武内　省二

Bibliographic Details