Epoxy resin composition and its production

Abstract

Abstract PURPOSE:To obtain an epoxy resin composition for semiconductor sealing having excellent moisture resistance and a low a stress, by adding strongly water-repellent flexible silane compound containing a silane coupling agent having a silanol functionality <=2 to a resin material and reacting the mixture under an alkaline condition or in contact with superheated steam. CONSTITUTION:A silane coupling agent, silane functionality <=2, and 0.5-3% silicone oil are premixed with part or the whole of at least one material containing a filler in contact with superheated steam or under an alkaline condition of pH>8. Then the mixture is mixed with the remaining portion of the material. The epoxy resin thus produced is mixed with a curing agent, a cure accelerator, a filler, a mold release, a surface-treating agent, etc., to obtain the title epoxy resin composition. This composition is excellent in moisture resistance, useful as a semiconductor-sealing resin having a low stress and particularly useful in the mass production of parts of electrical devices and instruments.

Inventors

• 👤 Mitsuo Kakehi
• 👤 筧　允男
• 👤 Yukihisa Ikeda
• 👤 恭久 池田
• 👤 Shigeru Koshibe
• 👤 茂 越部
• 👤 Giyouji Hirata
• 👤 仰二 平田

Bibliographic Details