Connecting structure of high frequency parts

Abstract

Abstract PURPOSE:To realize an electrical connecting structure which is faithful to a design with high stability and small variance, by connecting the parts to be conducted of a high frequency parts with a wire bonding process. CONSTITUTION:A filter of this example contains the resonators 21a-21d, and these resonators are set in parallel to each other in a case which is not shown in the figure. The resonators 21a-21d are connected and fixed to the case electrically and mechanically. A ceramic plate 9 is also stored and fixed into the case at the open end side of the resonators. An input pin 12 and an output pin 13 pierce through the plate 9 at the positions apart from the electrodes 10a and 10f to be held fixedly. The bonding wires 25a-25d connect the parts toward the open ends of the inner conductors 22a-22d to the electrodes 10a-10d respectively. A wire 25e connects the pin 12 to an electrode 10e and a wire 25f connects the pin 13 to an electrode 10f. In such way, an electrical connecting structure, which is faithful to a design with high stability and small variance, can be obtained.

Inventors

• 👤 Toshio Nishikawa
• 👤 敏夫 西川
• 👤 Yohei Ishikawa
• 👤 容平 石川
• 👤 Shuichi Wada
• 👤 秀一 和田

Bibliographic Details