Preparation of resin mold type electronic parts

Abstract

Abstract PURPOSE:To manufacture a plurality of electronic parts at a time and curtail the manufacturing processes by filing a recess portion of jig with a resin material while the electronic parts are pressurizingly held with electrodes and by giving the sheath to the essential part including electronic parts. CONSTITUTION:The upper jig 8 is removed, movable jigs 9, 10 are moved by sliding to the right or left, and the one electrode 5 is loaded to an extruded portion 7b of the lower jig 7. The other electrode 5 is also loaded to an extruded portion 8b of the upper jig 8. In the state while a pellet 1 is pressurizingly held between electrodes 5, 5, a jig 6 is supplied to the resin injecting apparatus. This resin injecting apparatus causes a resin material 6 to pass a gate 7d from a runner 13 and enters into the space surrounded by the lower jig 7 and the upper jig 8. When the jig 6 is heated under such condition and the resin material 16 is hardened, a diode can be obtained. A resin mold type diode can be obtained by bending the leg 5b of electrode 5 of such diode along the external surface of resin mold portion 3.

Inventors

• 👤 Toshiaki Moriyama
• 👤 敏明 森山

Bibliographic Details