Semiconductor device package

Abstract

Abstract PURPOSE:To eliminate the generation of cross-talk between conductive film terminals by embedding an insulator in the groove formed on the metal base material and by forming conductive film terminal at the surface of such insulator. CONSTITUTION:A package is structured by a metal base material plate 11, a groove 12 formed on said metal base material plate, an insulator 13 consisting of alumina ceramic embedded to said groove 12 and a conductive film terminal 14 such as metallized film formed on the surface of said insulator 13. The conductive film terminal 14 is surrounded by a metal base material 11 through an insulator 13 and the metal base material 11 is usually kept at the earth potential. Therefore, the shield effect is generated and thereby cross-talk does not occur between terminals.

Inventors

• 👤 Eiji Yamamura
• 👤 山村　栄志

Bibliographic Details