Lead frame for ic and ic using the same

Abstract

Abstract PURPOSE:To heighten stability of a tab and minimize displacement of the tab caused be the flowing resin, by arranging leads for hanging the tab in diagonal directions of a package in a lead frame for IC used together with a resin mold package. CONSTITUTION:Leads 16A and 16C for hanging a tab each having a lead 18 and a resin dam 20 are projected from one of outer frames 12A and 12B composing a lead frame 10. Leads 16B and 16D for hanging a tab in the same construction are projected from the other outer frame 12B, and at the points of those leads a tab 14 fixing an IC chip is fixed. In this constitution, the leads 16A, 16D and 16B, 16C arranged diagonally are built up face to face respectively. The tab 14 is stabilized when resin is poured into a cavity from direction (a) to miniminze this displacement, and at the same time, disconnection of a connector wire or the like is also prevented.

Inventors

• 👤 Yoshiaki Wakashima
• 👤 若島　喜昭
• 👤 Hideo Inayoshi
• 👤 秀夫 稲吉
• 👤 Kunihiko Nishi
• 👤 邦彦 西

Bibliographic Details