Semiconductor device

Abstract

Abstract PURPOSE:To perform a resin sealing without any burr, by arranging a rubber- like resin layer on the periphery of the resin-sealed part of a circuit substrate. CONSTITUTION:A rubber-like resin layer 15 is provided leading to the periphery of the scheduled seal part of a circuit substrate 11 and to an end thereof. Fastened by metallic molds 19 and 20, molten resin runs through runners 17, 18 and the resin layer 15 is forced into the seal part. In this occasion, the rubber-like resin layer 15 absorbs the roughness of the substrate 11, so that no resin burr will be produced. Such resins as Si, polyurethane, etc., are used for the resin layer 15, which is formed by printing or laminating sheets. This constitution makes it possible to obtain products constant in shape and excellent in appearance as well as improve workability.

Inventors

• 👤 Takayuki Uno
• 👤 宇野　隆行

Bibliographic Details