Cooling apparatus for semiconductor element

Abstract

Abstract PURPOSE:To reduce size of cooling apparatus and cool as required semiconductor elements by using a thermo module. CONSTITUTION:A thermo module M is provided between a heat sink H and power transistor Tr and a metal plate B in the heat generating side is coupled to the heat sink H, while a power transistor Tr to a metal plate A in the heat absorbing side. When a current is applied to the thermo module M in such a structure, temperature difference T is generated between the heat sink H and power transistor Tr and the power transistor Tr can be set to a temperature lower than the heat sink H by only DELTAT. Therefore, when the heat sink H is cooled, a power transistor Tr is cooled while a temperature different DELTAT is kept and when heat generation of transistor Tr increase, heat absorption Q increases preventing temperature rise of Tr when an current being supplied increases.

Inventors

• 👤 Masahiro Hirano
• 👤 平野　正宏

Bibliographic Details