Light emitting element pellet

Abstract

Abstract PURPOSE:To facilitate the pattern recognition of a light emitting element pellet used for an automatic recognition bonder by roughing the main surface of a semiconductor material of the part for disturbing the pattern recognition of a bonding pad to lower the reflectivity. CONSTITUTION:A P-N junction is formed by liquid epitaxial growth on an N type semiconductor substrate on a gallium phosphide wafer 4, a silicon oxidized film is coated on the wafer 4, only circular oxidized film 3 remains by a photoresist method, the wafer 4 is then boiled with hydrochloric acid for 2-3 min to remove the part covered with the film 3, thereby roughing the crystalline surface. Then, the film 3 is removed, zinc is diffused in the wafer 4 to enhance the surface density, aluminum is deposited, is heat treated, and pattern is formed as P type side electrodes 2, 2'. At this time the size of the circular electrode 2 is formed with the same size as the film 3. Then, the back surface of the wafer 4 is surface-treated to form an N type side ohmic contact.

Inventors

• 👤 Kazuo Kiyohashi

Bibliographic Details