Resin composition for plating

Abstract

Abstract PURPOSE: To provide a titled resin composition which permits application of electroplating directly by saving electroplating by compounding respectively prescribed ratios of an ionomer resin, carbon black, sulfur and metallic powder or metallic sulfide and a thermoplastic resin. CONSTITUTION: A resin composition for plating consisting of compounding 1W 30pts.wt. an ionomer resin (Zn type or Na type), 0.05W7pts.wt. sulfur, and 1W 20pts.wt. metallic powder or metallic sulfide with 100pts.wt. a thermoplastic resin (e.g.; PE). Powder of Ni, iron or the like is used for said metallic powder, and zinc sulfide, antimony sulfide, etc. are used for the metallic sulfide, respectively. This resin composition eliminates electroless plating (chemical plating) processes completely and permits direct electroplating. When strike nickel plating is applied to the moldings of this composition, the moldings exhibits ≥2.0kg/ cm plating adhesive strength within 5min/dm 2 throwing power time, and have a good appearance free from pinholes and the like. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Kazuo Hoshi
• 👤 Yoshio Nakagawa

Bibliographic Details