Patent JPS5779652A successfully refreshed from Google Patents.
JPS5779652A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Resin-sealed semiconductor device
Assignee: NEC Corp
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Filing: 1980-11-05
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Granted: —
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Expires: 2000-11-05
Abstract
Abstract PURPOSE:To facilitate thinnerization and miniaturization of a package, by connecting an integrated circuit electrode and an external terminal via a through- hole of a printed circuit board. CONSTITUTION:A semiconductor integrated circuit 1 is mounted on a printed circuit board 6. A metal wire 4 and a conductive lead 7 are connected. The conductive lead 7 and an external terminal 9 are connected via a through-hole 8. The integrated circuit 1 is sealed with resin 5. This takes more external terminals. The resin-sealing on one surface enables thinnerization and miniaturization of a package.
Inventors
- 👤 Takashi Taniura
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-02 22:02
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/50; H10W72/551; H10W72/552; H10W72/851; H10W72/874; H10W72/884; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
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