Formation of electrode

Abstract

Abstract PURPOSE:To enable to form easily a bump by a method wherein after a metal coating is provided by electroless plating on the exposed part of a wiring conductor film being covered with an insulating film, melted solder is deposited for formation. CONSTITUTION:An opening is provided in the oxide film 104 to cover the wiring conductor film 105 on an Si substrate 106, the middle metal film 112 of Au, Ag, Pb, Sn, Ni, etc., is formed by electroless plating on the exposed wiring conductor film, and melted solder is deposited on the metal film thereof to form the bump 111. Accordingly the progress of work is simplfied, and formation of bump is facilitated.

Inventors

• 👤 Junichi Kato

Bibliographic Details