Semiconductor device

Abstract

Abstract PURPOSE:To contrive the increase of bonding strength of a small pellet in order to prevent separation of the pellet by forming fine unevenness on at least one of the rear surface of the pellet and the surface of a base side member. CONSTITUTION:A pellet 3 having many irregular and fine unevenness 3a on the rear surface is prepared. This pellet 3 is pressed on Ag paste 2 that a conductive adhesive agent previously applied on a tab 1. With the state, said pellet 3 is dried in the temperature range of 100-150 deg.C for about one hour and thereby the pellet 3 is bonded to the tab 1. Hereby, the bonding strength the pellet 3 is improved.

Inventors

• 👤 Koichi Kiyozuka

Bibliographic Details