Plasma etching

Abstract

Abstract PURPOSE: To make etching uniform by a method wherein insulation boards with conductive films are placed on the back side of substrates to be processed and etching process is performed, so that generation of plasma concentration in the region touching the substrates to be processed is suppressed. CONSTITUTION: Two quartz boards 14 to which corrosion resistant metal films 13 are attached are coupled with such an angle that they can hold substrates 15 to be processed, so that a substrate holding jig 17 is composed. The substrates 15 to be processed are mounted in substrate mounting grooves 16 provided on the quartz boards 14 at the lower position than the top end of the board and the substrate holding jig 17 is brought into a plasma etching vessel and ashing of negative resist is performed. With above configuration electric field concentrates to the top end of the conductive board nearest to an upper electrode which is a supply side electrode of a plasma etching equipment through the metal film of that conductive board and the plasma concentration is generated near the top end of the conductive board, so that it is not generated in the region touching to the substrate to be processed. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Hisao Haruyama

Bibliographic Details