Marking method of resin-sealed semiconductor device

Abstract

Abstract PURPOSE:To enhance the adhesivity between the mark ink and the surface of a sealed resin by burning a die releasing agent exuding over the surface of the sealed resin with a flame holding heat within the range of maintaining the appearance properly in a pretreatment. CONSTITUTION:In a process of marking the surface of a sealed resin, a pretreatment is used to burn a die releasing agent exuding over the surface thereof. In this process, a flame is produced from 5-10l/hr of hydrogen gas with a burner 0.1- 0.3mm. in internal diameter. This flame is moved linearly at the rate of 5-15mm./sec under the temperatue of 600-800 deg.C over the surface of the resin sealed device tilted by 45 deg. about 10mm. separated from the tip of the burner. This removes the die releasing agent such as C, H, O and N from the surface by burning, thereby permitting a mark ink to adhere to the activated resin surface. Thus, a firm marking is printed thereon.

Inventors

• 👤 Yuji Miura
• 👤 Michitoshi Sera
• 👤 Tetsuo Ito
• 👤 Atsushi Sonoda

Bibliographic Details