Plating method

Abstract

Abstract PURPOSE: To form a plated film excellent in adhesiveness and electric conductivity onto an inorganic oxide substrate, by electrolessly plating the substrate with use of a plating solution comprising Ni and Co salts into which a Zn salt is added, and then copper strike-plating the substrate. CONSTITUTION: An electroless plating solution containing, as main components, one or more of Ni and Co salts, 0.075W1.5mol ratio of a zinc salt to the metal salt and a hypophosphite as a complexing agent and also as a reducing salt is prepared. An inorganic oxide substrate, e.g. alumina, silica or the like, is electrolessly plated with use of this plating solution. The substrate is then plated with copper in a copper strike bath. Thereafter, the substrate is coated with a thick copper layer in a bath having a conventional composition. According to this method, a plated film having a film adhesiveness and excellent in electric conductivity can be obtained. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Yoshihiro Suzuki
• 👤 Satoru Ogiwara
• 👤 Komei Yatsuno

Bibliographic Details