Semiconductor device

Abstract

Abstract PURPOSE:To prevent water content from penetrating through the contacting surface of an electrode lead and resin by forming narrow width of the boundary between the resin of the lead and the atmospheric air when the electrode lead is led externally from a semiconductor element sealed in the resin. CONSTITUTION:Electrode leads 11, 12, 13 for base, collector and emitter respectively are so disposed parallel to each other so that the collector lead 12 is located at the center, and a semiconductor pellet 14 is soldered to the lead 12. Narrow parts 11', 12', 13' are formed at the respective leads 11, 12, 13, and resin 17 is so formed as to seal the upper part at the boundary of the parts 11', 12', 13'. Thus, it can prevent water content from penetrating through the contacting surface between the resin 17 and the leads 11, 12, 13, thereby enhancing the moisture resistance of the element.

Inventors

• 👤 Muramasu Oomori

Bibliographic Details