Semiconductor device

Abstract

Abstract PURPOSE:To prevent the occurrence of a crack or a defect due to the impact of ceramics during the steps of manufacturing and inspecting by providing a projected cushion piece on the end face of a package containing a semiconductor. CONSTITUTION:A cusion piece 4 is formed at the position slightly projected from a ceramic piece from the end face of a ceramic case 1 in a longitudinal direction. This piece 4 can be used to cut off a frame at the time of cutting and bending a lead frame by utilizing the lead frame or can be used as the lead at the end when forming the lead frame as cushion piece 4. Since the cushion piece 4 can be thus simply formed, even if ceramic pieces drop from rails so that the packages are impacted in an automated manufacturing apparatus or inspecting device, no crack nor defect is caused, and thereby improving the yield of the manufacture.

Inventors

• 👤 Hideaki Takano

Bibliographic Details