Manufacture of hybrid integrated circuit

Abstract

Abstract PURPOSE:To form highly accurate capacitors and to contrive the integration of a hybrid IC by a method wherein a plurality of electrodes are formed facing each other while sandwiching dielectrics in an insulating substrate, and wiring terminals led out frm the electrodes are freely connected on the surface of the substrate to adjust the capacity of the capacitors. CONSTITUTION:Aluminium interposed between electrodes 11 and 11' facing each other in the longitudinal direction of a ceramic insulating substrate 10 becomes unit capacitors C11 and aluminum interposed between electrodes 11' and 11'' formed in series under the unit capacitors C11 becomes unit capacitors C11'' and 16 pieces of two series-connected unit capacitors are connected in parallel and 32 unit capacitors in total exist. The wiring terminals of these electrodes are led out to the surface of the insulating substrate 10 as 11L, 11'L, 11''L and capacitors having required capacitance are formed by properly connecting the 11L, 11'L, 11''L. In this method, highly accurate capacitors are formed in the insulating substrate for miniaturization and the integration of a hybrid IC will be improved.

Inventors

• 👤 Tetsushi Wakabayashi

Bibliographic Details