Hybrid integrated circuit device

Abstract

Abstract PURPOSE:To prevent a circuit board from displacement and an adhesive from overflowing, by providing a dam along the rim of a circuit board on which a heat sink is mounted. CONSTITUTION:A dam 13 is provided along the rim of a circuit board 1 on which a heat sink 11 is mounted. A groove 13 is provided along the inner side of the dam 12. As a result, an adhesive 13 does not overflow before hardening. As the circuit board 1 is fastened by the dam 12, mislocation does not occur. Therefore, mislocation and adhesive overflow can be prevented and yield can be improved. Said dam and groove can be pressed in process. An electronic part is shown as 2 in Figure.

Inventors

• 👤 Toshio Hiroe

Bibliographic Details