Taking-out of semiconductor chip

Abstract

Abstract PURPOSE:To commonly, easily and surely suck chips having different thicknesses and to take out the chips from a tray uniformly unifying the depth of a chip accommodation chamber by improving the shape of a collet. CONSTITUTION:A chip tray 31 having a plurality of chip accommodation small chambers 33 divided by partition walls 32 has an air flow hole 34 at the bottom section of each small chamber 33. In a collet 36 sucking a chip 35 and fetching the chip 35 from the chip tray 31, the sucking surface 37 of the collet 36 is of a sucking plane configuration having larger area than that of the divided small chamber of the chip tray 31. With the sucking surface 37 pressed to the upper surface of each small chamber 33 divided wall of the chip tray 31 and with vacuum suction applied to the chip 35 from a vacuum suction hole 38 provided at the collet 36, the chip 35 is surely sucked to the chip sucking surface 37 by the sucking force of the collet 36 and by the force action of air flow inflowing to each small chamber 33 through the air flow hole 34 and it becomes possible to take out the chip 35.

Inventors

• 👤 Toshio Komuro

Bibliographic Details