Integrated circuit device

Abstract

Abstract PURPOSE:To increase a packaging density, by a method wherein integrated circuits are arranged at the upper and the lower surface of an insulating supporter and flip chip bonding connection sections are formed on a part of connecting terminal rows and the remaining connection terminal rows and wire bonding pads are connected with wires. CONSTITUTION:An integrated circuit 2 is provided at the lower surface of an integrated circuit chip 1 and an integrated circuit 5 is provided at the upper surface of the integrated circuit chip 1 to form flip chip bonding connection sections 3, 4 on the integrated circuit 2 and connection terminals 13, 14 are arranged at a three-layer laminating supporter 8 at the positions corresponding to terminals 3, 4 and the connection terminals 13, 14 are connected to external leads 9, 10. The wire bonding pads of the integrated circuit 5 are connected to connection terminals 15, 16 provided at the upper opposite sides of the concave sections of the supporter 8 by means of wires 17, 18 and the connection terminals 15, 16 are connected to external lead 9, 11 to seal them with a cap 12. This method permits packaging twice as high in density.

Inventors

• 👤 Hidehiko Akasaki
• 👤 Eiji Aoki

Bibliographic Details