§
Luxuse
Patent Intelligence
Sign In
Patent JPS5740943A successfully refreshed from Google Patents.
← Back to Patent Explorer
JPS5740943A Expired / Lapsed JP ⏱️ 0.0 years remaining

Semiconductror device

Assignee: Mitsubishi Electric Corp
•
Filing: 1980-08-22
•
Granted: —
•
Expires: 2000-08-22
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract PURPOSE:To increase the adhesion between a bonding pad and an electrode metal, by a method wherein unevenness is provided at the oxide film located just under the bonding pad of a semiconductor device and the bonding area of the oxide film and the bonding pad is increased. CONSTITUTION:Unevenness 7 is formed on the surface located just under the bonding pad of an oxide film 2 provided on a semiconductor substrate 1 and the bonding pad 52 is provided at the uneven part to bond the pad to an external lead terminal 8. This method increases the bonding area between the oxide film and the bonding pad and improves the adhesion between the bonding pad and the metal electrode.

Inventors

  • 👤 Yuji Kusano

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-05 17:37
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; H10W72/071; H10W72/075; H10W72/07551; H10W72/07553; H10W72/50; H10W72/531; H10W72/536; H10W72/59; H10W72/931; H10W72/934

Claims Analysis

Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Maintenance schedule is calculated for granted US utility patents.

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag