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JPS5720443A Expired / Lapsed JP ⏱️ 0.0 years remaining

Container for small thin piece

Assignee: Mitsubishi Electric Corp
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Filing: 1980-07-10
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Granted: —
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Expires: 2000-07-10
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Abstract

Abstract PURPOSE:To prevent the damage of a chip to be conveyed or the like by covering the upper surface side of a container having a recess for containing a chip with soft resin, and coating a cover via a silk cloth or sponge member from the top of the container, thereby securing the container chip. CONSTITUTION:A covering layer 6 of 1-5mm. of thick made, for example, of silicone resin is formed on a container 1 having a plurality of recesses 1a of the width to which pincers 3 are inserted for containing chips 3, made, for example, of hard resin material. Extrafine woven silk cloth 7 and sponge member 8 for fixing the chips 2 are superposed as charge preventing cover on the top of the container 1 for containing the chips 2, and a cover 5 is further coated on the top for stock or transportation. Thus, the chip 2 can be prevented from being damaged or cracked, and the container adapted for GaAs high frequency element chips, etc. can be provided.

Inventors

  • 👤 Aiichiro Nara

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-09 08:43
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/10; H10P72/19; H10P72/1902; H10P72/1904; H10P72/1911; H10P72/1912; H10P72/50

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Total Claims: 0
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