Lsi package

Abstract

Abstract PURPOSE:To enhance the heat radiating efficiency of an LSI package and to reduce the package by providing a modified pad on the surface of a ceramic substrate to which an LSI chip is placed and input/output pins are implanted, and connecting the chip to the pins through the pad. CONSTITUTION:An LSI chip 1 is placed at the center on a ceramic substrate 2, and input/output pins 3 are implanted onto the overall surface of the substrate 2. Modified pad 11 and the pins 3 are connected in the vicinity of the pins 3. The pad 11 is connected to the chip 1 via an internal lead pattern 13. In this manner, heat radiating efficiency is raised to reduce the size of the package.

Inventors

• 👤 Masafumi Okamoto

Bibliographic Details