Formation of metal projection on metal lead

Abstract

Abstract PURPOSE: To make the number of process of work to small and to reduce cost of a semiconductor device by a method wherein a metal projection formed on a separated substrate is joined to a lead wire on a film carrier and is stripped off from the substrate, and the metal projection transferred on the lead wire is joined to an electrode on a semiconductor element. CONSTITUTION: The electrode lead wire 22 formed by plating Sn on Cu foil is adhered on the resin tape 21. While the metal projection 24 is formed on the substrate 23. The metal projection 24 of gold and the metal lead wire 22 are positioned, and when heating and pressing are performed with a tool 26, the metal projection 24 is joined with metal lead wire 22, and when pressure 27 is removed, the metal projection 24 is stripped off from the substrate 23 to be transferred to the metal lead wire 22. When the metal projection is positioned with the Al electrode 28 on the semiconductor element 25 and is heated with pressure, both are joined completely. Accordingly the progress of work is simplified, and cost can be reduced. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Kenzo Hatada
• 👤 Isamu Kitahiro

Bibliographic Details