JPS5339868A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Packaging method of semiconductor device
Assignee: Fujitsu Ltd
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Filing: 1976-09-24
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Granted: —
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Expires: 1996-09-24
Abstract
Abstract PURPOSE: To improve packaging yield by positively aligning the positions of the electrode patterns of elements and the protrusions of lead fingers and performing bonding simultaneously. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Ikuo Tomita
- 👤 Eiichi Ito
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-05 12:49
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701
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