Silicone resin composition

Abstract

Abstract PURPOSE: The titled composition in which a ladder-chain silicone resin is combined with a polymer or oligomer compatible with the same to improve the film-forming properties without any adverse effect on the heat resistance, thus preventing the coating films from cracking after heat curing. CONSTITUTION: A ladder-chain silicone resin of the formula (R, R' are alkyl, alkenyl, aryl), preferably of 10W1,000 polymerization degree and 5,000W100,000 molecular weight, is combined with a polymr or oligomer compatible with the silicone resin such as a silicone polymer bearing hydroxyl groups, silicone oligomer or polyethylene glycol. The amount of the polymer or oligomer added is preferably less than 10wt% based on the silicone resin. USE: This composition is suitably used as a heat-resistance protecting film in the field of electronic materials. COPYRIGHT: (C)1982,JPO&Japio

Inventors

• 👤 Yoshio Matsumura
• 👤 Ikuo Nozue
• 👤 Nagahiko Tomomitsu
• 👤 Takashi Ukaji
• 👤 Taro Suminoe

Bibliographic Details