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Patent JPS57100752A successfully refreshed from Google Patents.
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JPS57100752A Expired / Lapsed JP ⏱️ 0.0 years remaining

Semiconductor device

Assignee: Toshiba Corp
•
Filing: 1980-12-16
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Granted: —
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Expires: 2000-12-16
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Abstract

Abstract PURPOSE:To prevent the production of stress by providing resin covering a semiconductor element mounted on a lead frame with gelled conductive resin symmetrically with respect to the lead frame. CONSTITUTION:A semiconductor element 2 is mounted on an element mounting base floor 1b of a lead frame with gelled conductive resin 3 with hardness lower than 3 in Shore A hardness, while a JCR layer 14 is covered on each of both surfaces of the lead frame, and is sealed with sealing resin 5 such as epoxy resin. Thus, since the mounting agent is in gel state, no stress is produced with the semiconductor element, thereby obtaining preferable electric characteristics.

Inventors

  • 👤 Kazuhiro Nishiki

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-04 20:23
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756

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Total Claims: 0
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