Semiconductor device

Abstract

Abstract PURPOSE:To prevent the production of stress by providing resin covering a semiconductor element mounted on a lead frame with gelled conductive resin symmetrically with respect to the lead frame. CONSTITUTION:A semiconductor element 2 is mounted on an element mounting base floor 1b of a lead frame with gelled conductive resin 3 with hardness lower than 3 in Shore A hardness, while a JCR layer 14 is covered on each of both surfaces of the lead frame, and is sealed with sealing resin 5 such as epoxy resin. Thus, since the mounting agent is in gel state, no stress is produced with the semiconductor element, thereby obtaining preferable electric characteristics.

Inventors

• 👤 Kazuhiro Nishiki

Bibliographic Details