Vacuum treating device

Abstract

Abstract PURPOSE:To convey wafers securely with a small-type device by a method wherein the wafers are conveyed from a treating chamber into a containing chamber and vice versa by a single truck. CONSTITUTION:After etching in the treating chamber 1 is completed, the wafer 6 on an electrode 3 is pushed upward by a lift 18 and simultaneously a fork 23 at the tip end of a double-pulley truck 21 in the containing chamber 9 is moved toward a place directly below the lifted wafer 6. When the fork 23 reaches the place directly below the wafer 6, the lift 8 is lowered so that the wafer 6 is placed on the fork 23. The fork 23 with the wafer 6 placed thereon is returned to the chamber 9 and stopped above a lift 20 near a communicating port. After the lift 20 pushes the wafer 6 on the fork 23 upwards, the truck 21 is retracted. When the wafer 6 is placed on the lift 20, the lift 20 is lowered to transfer the wafer 6 onto a belt 22 and then the wafer 6 is contained in a containing cassette 11. Similar operations are conducted when the wafer is conveyed from the chamber 9 to the chamber 4.

Inventors

• 👤 Yasuhiro Horiike
• 👤 Hidetaka Jo
• 👤 Tetsuo Kurisaki

Bibliographic Details