Wire bonding device

Abstract

Abstract PURPOSE:To manufacture a gold ball positively by a method wherein a clamper for compensation is fitted to an upper portion of a clamper for cutting, the clamper for cutting is opened after a gold wire is cut, discharge is conducted, the clamper for compensation is let fall when electricity is not discharged, and the gold wire is projected from a capillary. CONSTITUTION:Clampers 10, 11 for cutting and compensation are opened, a capillary 2 is moved onto a lead 7 and let fall, and a gold wire 1 is fixed to the lead 7 by means of the capillary 2. The clampers 10, 11 are closed after the gold wire is fixed, and the gold wire is slightly lifted and cut at a bonding portion. The clamper 11 is not displaced at that time. When the clamper 10 is opened, the gold wire is projected under the capillary 2 only by the quantity of slackness. The clamper 10 is closed, each clamper and the capillary are moved to fixed height, an electrode 22 is projected, and electricity is discharged between a tip of the projected gold wire and the electrode, thus manufacturing a gold ball 4. The electrode 22 is retreated after forming the ball, the clampers 10, 11 are opened, each portion is recovered, and the next wire is bonded. When the ball is not formed yet, a device is stopped, the gold wire with fixed length is let fall to a lower end of the capillary, the gold ball is positively formed, and the device is again operated.

Inventors

• 👤 Yuzo Taniguchi

Bibliographic Details