Removing method of component carried on printed board

Abstract

Abstract PURPOSE:To reduce the heat load of the connecting portion of a pad to a lead wire on a printed board and remove the component on the printed board by supplying solder to the connecting portion and heating the contacting portion of the connecting portion with the lead wire by a heating tool treated with preferably wetting property with solder on the surface. CONSTITUTION:A solder foil is formed at the connecting portion of a pad with a lead wire 3 on a printed board 1, a supply solder 10 of frame shape coinciding with the position of the lead wire 3 of a component 2 is formed, and is placed on the connecting portion. Then, a heating tool 7 treated with oxidation prevention is approached toward the component 2 from upside. When the heating portion 8 of the heating tool 7 is lowered to heat the connecting portion, the supply solder 10 is molten to fuse the solder of the pad at the lead wire 3. When the solder at the connecting portion is molten, an attracting tool 13 is simultaneously operated to remove the component 2 from the printed board 1.

Inventors

• 👤 Kozo Kanda
• 👤 Kanji Ishige

Bibliographic Details