Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To eliminate cracks of the resin of a resin-sealed semiconductor device at the time of mounting it by applying pressure in a direction opposite to the direction of deforming the device due to thermal shrinkage, thereby postcuring the resin and eliminating the warpage of the heat dissipating portion of the device as well as flattening it. CONSTITUTION:A resin-sealed semiconductor device such as, for example, a lower transistor incorporates a semiconductor chip 2 placed on a load frame 1 used also as a heat dissipating unit, external lead wires 4 provided thereat and sealing resin 3 sealed thereat. In such a device, the lead frame tends to slacken in curing. In order to apply counterslack to this slack of the frame lower and upper dies 6 and 7 of circular shape in cross section for imparting the ciunterslack are used to insert the device 9 between the engaging jigs thereof, pressure is applied by weight 8 thereto and the device is heated for postcuring the resin. When the resin is exhasuted in the counterslack state and is cooled, the resin is flattened due to contraction. Thus, the slack can be eliminated, and the crack of the device can be consequently eliminated.

Inventors

• 👤 Yoshiaki Sano
• 👤 Kazuya Takahashi
• 👤 Masaru Nemoto

Bibliographic Details