Automatic ultrasonic bonder

Abstract

Abstract PURPOSE:To permit the snapping of a wire to be reliably detected by allowing a detector to detect the revolution of the roller rotating by the tensile force of the wire. CONSTITUTION:By the bonding operation, a wire 1 is passed through a detecting roller 8 and pressure roller 9, pulled out in the direction of an arrow 11, and ultrasonically bonded on the surface of an IC 7 mounted in a ceramic case 6. On doing this, the roller 8 is rotated by the tensile force of the wire 1. The rotation is detected by a detector 10 not contacting with the roller 8 to know whether or not the bonding is normally performed, that is, whether or not the wire is broken. When the wire snaps, the rotation of the roller 8 stops and no detection output is provided from the detector 10. This stops the bonding operation automatically. Thus, properly selecting the roller distortion, slit distance, pressure and the like permits the snapping of the wire to be reliably detected.

Inventors

• 👤 Hiroshi Osabe

Bibliographic Details