Thermosetting resin composition

Abstract

Abstract PURPOSE: To prepare a rapid-curing long-life thermosetting resin composition suitable for sealing of electronic parts, forming of printed circuit boards, etc. by compounding a bis (trioxaspirononyl) compound and an imidazole compound. CONSTITUTION: A bis [1,4,6-trioxaspiro(4.4)nonyl] compound of formula (R is bivalent organic group) is prepared by reacting a bifunctional epoxy compound such as bisphenol A diglycidyl ether with γ-butyrolactone in the presence of a cationic catalyst such as BF 3 .ether complex. The objective thermoplastic resin composition is prepared by adding ≤10wt% of a curing catalyst comprising imidazole compounds such as 2-methylimidazole, or a mixture of imidazole compounds and tertiary amine compounds such as tetramethylbutanediamine, etc. The catalyst may be a mixture of two or more compounds. COPYRIGHT: (C)1981,JPO&Japio

Inventors

• 👤 Yutaka Ito
• 👤 Akio Takahashi
• 👤 Motoyo Wajima
• 👤 Yasusada Morishita

Bibliographic Details