Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To efficiently prevent flashes from being produced on the reverse side of a heat radiating plate, by providing a groove on the desired peripheral part of the reverse side of the heat radiating plate so that a narrow zone is located between the groove and the periphery of the plate and by positioning the wall surface of the recess of an opposed metal mold toward the groove and sealing up with resin. CONSTITUTION:The wall surface 8a of a metal mold 7 is brought into contact with the narrow zone 3 of the reverse side 1b of a heat radiating plate 1. The wall surface 9b of a recess 9 is located almost in the center of the groove 2 of the heat radiating plate. A lead 4 is pinch-held by metal molds 7, 10. A semiconductor device is set in a cavity. When the cavity is filled with resin 12', a small quantity of the resin flows down into the groove 2 but does not creep up on the wall surface 9b. As a result, salient flashes burrs are hardly produced.

Inventors

• 👤 Ikuo Watanabe

Bibliographic Details