Semiconductor device and its manufacture

Abstract

Abstract PURPOSE:To enable the formation of semiconductor chips with greater circuit functions by means of a simple process by a method wherein proper wiring is made up on a plurality of chips of an existing semiconductor substrate to which function elements are completely formed. CONSTITUTION:When forming wiring to two chips, differential amplifying circuits are made up in each chip region of a semiconductor substrate consisting of a plurality of chip regions C1, C2,...CX partitioned by scribe streets 1 by three transistors Tr1, Tr2, Tr3. Wiring mutually connecting each region of the transistors on the adjacent two chips is built up in place of a process forming the bonding pads 5', 6' of such a semiconductor device, and multiplexer chips shown in the figure are obtained. Thus, the semiconductor device with a greater circuit scale can be prepared by using the semiconductor substrate worked in order to prepare the existing semiconductor device.

Inventors

• 👤 Tetsuo Ide
• 👤 Hiroshi Iwamoto

Bibliographic Details