Holding mechanism for plate shaped substance

Abstract

Abstract PURPOSE:To obtain the holding mechanism with easy maintenance and control by holding a plate shaped fringe section to a flat holding surface by vacuum attraction wherein positioning is made for the surrounding face of the plate shaped substance by a guide set out to the holding substance and the grinding dimension accuracy of a wafer will be raised. CONSTITUTION:The fringe surface section of the plate shaped substance 7 is held to the flat holding surface 5 of a holding substance 1 by vacuum attraction and positioning is also made to the surrounding surface of the plate shaped substance 7 by a guide 3 set out to the holding substance 1. For example, a ring groove 2 is provided around the holding surface 5 of the holding substance 1 and a retainer 3 having a rectineal rotation-proof section 11 at an inner circumference section is set out in the groove 2. Small holes 9 for vacuum attraction are provided at the fringe section of the round shaped holding surface section 5 faced to the inside of the groove 2 and the holes 9 for vacuum attraction are connected to a vacuum pump through a guide hole 10 provided in the holding substance 1. In this way, the wafer 1 is directly held to the flat holding surface 5. Therefore, grinding dimension accuracy will be raised and maintenance and control of a holding mechanism will also be facilitated.

Inventors

• 👤 Masaru Tsukahara

Bibliographic Details