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JPS5633463A Expired / Lapsed JP ⏱️ 0.0 years remaining

Hot dipping method

Assignee: Nihon Parkerizing Co Ltd
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Filing: 1979-07-16
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Granted: —
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Expires: 1999-07-16
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Abstract

Abstract PURPOSE:To enhance the adhesion of hot dipping by simple operation with simple facilities by plating the surface of a steel sheet with Cu, Ni or Co singly or in the form of an alloy and carrying out predetermined hot dipping in an atmosphere of a specified hydrogen concn. CONSTITUTION:One side or both sides of a steel sheet are plated with Cu, Ni or Co singly or in the form of an alloy or with two or more among Cu, Ni and Co in layers. The plated sheet is then hot dipped by being introduced into a hot dipping bath of Zn, a Zn-Al alloy or the like under an atmosphere contg. hydrogen of its explosion limit or below, e.g., <=4% hydrogen or contg. CO and hydrogen of its explosion limit or below. By this method the adhesion of hot dipping is enhanced.

Inventors

  • 👤 Shoji Shimada

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-02 23:19
CPC Classifications
C; C23; C23C; C23C2/00; C23C2/02; C23C2/022; C23C2/0222; C23C2/024

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

JPS52130433A Cited

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