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JPS5628240A Expired / Lapsed JP ⏱️ 0.0 years remaining

Heat-resistant resin composition

Assignee: Daicel Corp
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Filing: 1979-08-15
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Granted: —
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Expires: 1999-08-15
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Abstract

Abstract PURPOSE: To prepare the titled composition having high heat deformation temperature and extremely homogeneous texture, without lowering the moldability, by compounding a methyl methacrylate-styrene copolymer with a mixture of a polycarbonate and a styrene copolymer. CONSTITUTION: The titled composition is prepared by melting and mixing (A) 100pts.wt. of a composition composed of (a) 99W45wt% of a 4,4'-dihydroxydiphenylalkane polycarbonate (esp. 2,2'-(4,4'-dihydroxydiphenyl)-propane polycarbonate) and (b) 5W55wt% of a styrene copolymer, pref. a copolymer of an aromatic vinyl monomer and a vinyl cyanide monomer and (B) 5W25pts.wt. of a copolymer composed of (c) 5W75wt% of methyl methacrylate and (d) 95W25wt% of styrene. COPYRIGHT: (C)1981,JPO&Japio

Inventors

  • 👤 Masami Kita
  • 👤 Minoru Yoshioka
  • 👤 Shinji Tokuhara

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-02 19:16
CPC Classifications
—

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

JPS4843449A Cited
JPS4916743A Cited
JPS50111150A Cited
JPS5323346A Cited

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