Continuous immersion soldering method

Abstract

Abstract PURPOSE: To prevent bubbles from remaining at the solder joining interface by dipping the plural soldering works having beforehand been coated with solder individually continuously into a molten solder bath while inclining these with respect to the bath surface. CONSTITUTION: A non-oxidative gas 3 is passed in a conduit 3 to make a non- oxidative atmosphere in the conduit 3. Next, a stabilized Cu base material 1 of a channel shape in section which is one soldering work and has been built in with superconductive conductors 4 being the other soldering work into the groove 11 thereof is passed into the conduit 3 with the upper part of the groove 11 faced upward and while its inclination is being maintained, it is fed and immersed into molten solder 8. Within the groove 11 where there are no films for preventing solder deposition of the base material 1 surface, the solder having beforehand been coated on the base material 1 and the conductors 4 being to melt at the bath surface 6, thereby soldering the interface of both 1, 4 together with the solder 8. Since no flux is used at this time, there are no bubbles owing to its decomposition; in addition, the deposited bubbles escape from the uper part of the groove 11. Further, an ultrasonic vibrator 5 makes the soldering and bubble removable of both 1, 4 easy. COPYRIGHT: (C)1981,JPO&Japio

Inventors

• 👤 Takuya Suzuki
• 👤 Ikuo Ito
• 👤 Itaru Inoue

Bibliographic Details