Semiconductor lead frame

Abstract

Abstract PURPOSE:To contrive the improvement in the head dissipating effect of the semiconductor lead frame by retaining the metallic portion between adjacent internal lead wires and connecting one of the metallic portion to a semiconductor element fixing portion. CONSTITUTION:A cutout 7 is formed on an external lead wire in the vicinity of the outer periphery of a package, a gap is formed between the adjacent internal lead wires 2, 3 and heat dissipating plates 4, 5, and the plates 4, 5 having bent portions 8 are displaced together downwardly of the adjacent internal lead wires 3. In this manner the internal lead wire does not shortcircuit with the heat dissipating plates. In this manner, the element fixing portion and the heat dissipating plates extended from the fixing portion are disposed below or above the internal lead wire positioning level to utilize the width of the interval between the internal lead wires and the heat dissipating plates in a plane as heat dissipating plates so as to improve the dissipating effect of the element.

Inventors

• 👤 Nobutaka Nagamine

Bibliographic Details