Semiconductor device

Abstract

Abstract PURPOSE:To ontrive the improvement in the packaging density of the semiconductor device and the reduction of the influence of an alpha ray thereto by confronting active or passive element forming surface of semiconductor and containing them in the same container. CONSTITUTION:Semiconductor chips 7, 7' are loaded on the stages 1, 1' of lower and upper ceramic containers 6 and 6' respectively, and are connected through conductors 8, 8' to internal wiring layers 4 and 4' respectively. The containers 6 and 6' are so superimposed so that the chip surfaces confronts each other, and are sealed with glass 9. The element forming surfaces of the chips 7 and 7' are formed as near as possible and are confronted regularly. The external lead wires 5 of the lower container 6 and the external lead wires 5' of the upper container 6' are displaced by half pitch in an arrangement. This configuration improves in the packaging density of the semiconductor device and shields alpha rays through the confronting chips to thereby improve the reliability of the device.

Inventors

• 👤 Hideo Kashimada

Bibliographic Details