Transfer molding device

Abstract

Abstract PURPOSE:To prevent the mixing of air bubbles in a resin liquid by providing a liquid-holding part at the end part of a subrunner in the captioned device for preparing a resin-mold type semiconductor. CONSTITUTION:A runner 4 is constituted by a main runner 4a and a subrunner 4b communicating with the former, while a liquid-pooling part 9 of proper capacity is provided in the end part of the subrunner 4b. A resin liquid flows in the subrunner 4b through the main runner 4a and, filling cavities 6 sequentially, further flows in the liquid-holding part 9 provided in the end part of the subrunner 4b. When the ?quantity of the liquid thus flowing-in reaches the level of about two thirds of the capacity of the liquid-holding part, the cavities 6 located on the side of liquid-holding part 9 are also fully filled with the resin liquid, thus molding a pellet 13. Accordingly, the air in cavities escapes to outside through air vents 8 without mixing in the resin liquid.

Inventors

• 👤 Daizo Inoue

Bibliographic Details