Semiconductor device

Abstract

Abstract PURPOSE:To obtain the semiconductor device having small size and high economy by fixing semiconductor pieces disposed in a pair of mirror relationship on the front and the back surfaces of a substrate for supporting it in the same manner to contain it in a conventional container. CONSTITUTION:The pair of semiconductor pieces C1, C2 of pattern are disposed in a mirror relationship. The semiconductor peices C1, C2 are fixed to both the front and back surfaces of a common supporting substrate RM, their input pads are connected to a common input external lead wire RL1, their output pads are connected to respective output external lead wires RL2, RL2', and resin is sealed at M including a part of the external lead wires. The supporting substrate and the external lead wires are stamped from a metallic piece. This configuration can eliminate difficult integrating technique with the large scale integration of circuit functions, but the outer dimensions of the container may be retained as those of the conventional structure to provide high economy. Further, the semiconductor pieces are connected to the external lead wires through the internal lead wires IM1L, IN1L' of the container, and accordingly provides high reliability.

Inventors

• 👤 Toshio Wada

Bibliographic Details