Thin film integrated circuit

Abstract

Abstract PURPOSE:To improve the bonding strength of a circuit to an external lead by bonding a tin-plated metallc lead onto a heated circuit substrate, thereby preventing the occurrence of a crack at the substrate. CONSTITUTION:When the conductor 2 of a circuit is bonded to an external lead 4, the lead 4 is tin-plated at 3, and is pressed to the conductor 2 on the ceramic substrate 1 heated at 100-200 deg.C (having a gold plating layer) and is thus bonded. Thus, it can be reduced by approx. 100 deg.C as compared with the case that it is gold plated at the time of bonding the lead, thereby alleviating the thermal stress. Thus, it can prevent the crack of a ceramic substrate, and can strengthen the bonding strength of the lead.

Inventors

• 👤 Masahide Murakami

Bibliographic Details